Iindlela zokupakisha ze-CPU zekhompyuter: i-LGA, i-PGA kunye nohlalutyo lwe-BGA

Isiqulatho

• 1. I-LGA
• 2. PGA
• 3. BGA
• 4. Isiphelo

1. I-LGA

1. Iimpawu zesakhiwo

I-LGA yindlela yokupakisha esetyenziswa ngokubanzi yi-Intel desktop CPUs. Olona phawu lwayo luluyilo olunokushenxiswa, olubonelela abasebenzisi ngokulula okuthile xa bephucula kwaye befaka endaweni ye-CPU. Kwiphakheji ye-LGA, izikhonkwane zibekwe kwi-motherboard, kwaye abafowunelwa bakwi-CPU. Ngexesha lofakelo, uxhulumaniso lombane lufezekiswa ngokulungelelanisa ngokuchanekileyo oonxibelelwano kunye nezikhonkwane kwi-motherboard kwaye uzicinezele endaweni.

2. Izinto eziluncedo kunye nemingeni

Inzuzo ebalulekileyo yephakheji ye-LGA kukuba inokunciphisa ubukhulu be-CPU ukuya kumlinganiselo othile, ohambelana noyilo olubhityileyo kunye nokukhanya kwekhompyuter. Nangona kunjalo, izikhonkwane zikwi-motherboard. Ngethuba lofakelo okanye ukususwa, ukuba umsebenzi awufanelekanga okanye amandla angaphandle achaphazeleka, izikhonkwane kwi-motherboard zonakaliswa lula, ezinokubangela ukuba i-CPU ingaphumeleli ukusebenza ngokufanelekileyo, okanye ifune ukuba i-motherboard itshintshwe, ibangele ilahleko ethile yezoqoqosho kunye nokuphazamiseka kubasebenzisi.

2. PGA

1. Ukwakhiwa kwepakethi

I-PGA yiphakheji eqhelekileyo ye-AMD desktop CPUs. Ikwamkele uyilo olunokuhluthwa. Izikhonkwane zephakheji zikwi-CPU, kwaye abafowunelwa bakwi-motherboard. Xa ufaka i-CPU, izikhonkwane kwi-CPU zifakwe ngokuchanekileyo kwiisokethi kwi-motherboard ukuqinisekisa uxhumo olulungileyo lombane.

2. Ukusebenza kunye nokuthembeka

Enye inzuzo yephakheji ye-PGA kukuba amandla ephakheji ayo aphezulu, kwaye izikhonkwane kwi-CPU zinamandla. Akulula ukonakala ngexesha lokusetyenziswa okuqhelekileyo kunye nokufakwa.

Ukongezelela, kubasebenzisi abathile abahlala besebenzisa i-hardware, njengabaxhasi bekhompyutheni abenza i-overclocking kunye neminye imisebenzi, i-PGA epakishwe i-CPU inokukwazi ukujamelana nokuxhuma rhoqo kunye nokukhupha kunye nokucima, ukunciphisa umngcipheko wokungaphumeleli kwe-hardware okubangelwa iingxaki zokupakisha.

3. BGA

1. Isishwankathelo seendlela zokupakisha

I-BGA isetyenziswa ikakhulu kwii-CPU ezihambayo, ezinjengeelaptops kunye nezinye izixhobo. Ngokungafaniyo ne-LGA kunye ne-PGA, ukupakishwa kwe-BGA akunakususwa kwaye yeye-CPU ekwibhodi. I-CPU ithengiswa ngokuthe ngqo kwi-motherboard kwaye iqhagamshelwe ngombane kwi-motherboard ngokusebenzisa i-spherical solder joints.

2. Ubungakanani kunye neenzuzo zokusebenza

Inzuzo ebalulekileyo yokupakishwa kwe-BGA kukuba incinci kwaye imfutshane, enamandla ngakumbi kwizixhobo eziphathwayo ezinendawo encinci, yenza iimveliso zelaptop zibe khaphukhaphu kwaye zithwaleke ngakumbi. Kwangaxeshanye, ngenxa yokuba ukupakishwa BGA ngokuqinileyo solders CPU kunye motherboard kunye, kunciphisa umsantsa phakathi kwamacandelo okudibanisa kunye ilahleko transmission umqondiso, nto leyo enokuphucula uzinzo kunye nesantya ukudluliselwa umqondiso ukuya kumlinganiselo othile, ngaloo ndlela ukuphucula ukusebenza CPU.

4. Isiphelo

Isishwankathelo, iindlela ezintathu zokupakisha ze-CPU ze-LGA, i-PGA kunye ne-BGA nganye ineempawu zayo kunye neemeko ezisebenzayo. Kwinkalo yeekhompyuter zolawulo lwamashishini, iimveliso ezikumgangatho ophezulu zolawulo lwamashishini ziyafuneka ukunika umdlalo opheleleyo ekusebenzeni kwazo. I-SINSMART Technology inamava oshishino olutyebileyo kunye neqela lobuchwephesha lobuchwephesha. Inokuqonda okunzulu kweempawu kunye neemfuno zeendlela ezahlukeneyo zokupakisha ze-CPU kwaye uzibophelele ekuboneleleni abathengi ngezinto ezilungelelanisiweyo, ezikumgangatho ophezulu wolawulo lweemveliso. Wamkelekile ukubuza.