Izindlela zokupakisha ze-CPU yekhompyutha yezimboni: ukuhlaziywa kwe-LGA, i-PGA kanye ne-BGA

Okuqukethwe

• 1. I-LGA
• 2. PGA
• 3. BGA
• 4. Isiphetho

1. I-LGA

1. Izici zesakhiwo

I-LGA iyindlela yokupakisha esetshenziswa kakhulu yi-Intel desktop CPUs. Isici sayo esikhulu kunazo zonke idizayini ekhiphekayo, ehlinzeka abasebenzisi ngokunethezeka okuthile lapho bethuthukisa futhi befaka esikhundleni se-CPU. Kuphakheji ye-LGA, izikhonkwane zitholakala ebhodini lomama, futhi abathintwayo baku-CPU. Ngesikhathi sokufakwa, ukuxhumana kukagesi kufinyelelwa ngokuqondisa ngokunembile othintana nabo nezikhonkwane ebhodini lomama bese ubacindezela endaweni.

2. Izinzuzo nezinselele

Inzuzo ephawulekayo yephakheji ye-LGA ukuthi ingehlisa ukujiya kwe-CPU ngezinga elithile, elivumela ukwakheka okuphelele nokulula kwekhompyutha. Nokho, izikhonkwane zikubhodi lomama. Ngesikhathi sokufakwa noma ukususwa, uma ukusebenza kungalungile noma amandla angaphandle ethintekile, izikhonkwane ebhodini lomama zilimala kalula, okungabangela ukuthi i-CPU ihluleke ukusebenza kahle, noma idinge nokuthi i-motherboard ishintshwe, okubangele ukulahlekelwa okuthile kwezomnotho kanye nokuphazamiseka kubasebenzisi.

2. PGA

1. Isakhiwo sephakheji

I-PGA iyiphakheji evamile yama-CPU wedeskithophu ye-AMD. Iphinde yamukele umklamo ohlukanisekayo. Izikhonkwane zephakheji ziku-CPU, futhi abathintwayo basebhodini lomama. Lapho ufaka i-CPU, izikhonkwane ku-CPU zifakwa ngokunembile kumasokhethi ebhodini lomama ukuze kuqinisekiswe uxhumano oluhle lukagesi.

2. Ukusebenza nokuthembeka

Enye inzuzo yephakheji ye-PGA ukuthi amandla ephakheji layo aphakeme kakhulu, futhi izikhonkwane ku-CPU zinamandla ngokuqhathaniswa. Akulula ukonakala ngesikhathi sokusetshenziswa nokufakwa okuvamile.

Ukwengeza, kwabanye abasebenzisi abavame ukusebenzisa i-hardware, njengabashisekeli bekhompiyutha abenza i-overclocking kanye neminye imisebenzi, i-PGA ehlanganisiwe ye-CPU ingase ikwazi ukumelana nokuxhuma njalo nokukhipha i-plug kanye nokulungisa iphutha, ukunciphisa ingozi yokwehluleka kwe-hardware okubangelwa izinkinga zokupakisha.

3. BGA

1. Uhlolojikelele lwezindlela zokupakisha

I-BGA isetshenziswa kakhulu kuma-CPU eselula, njengamakhompyutha aphathekayo namanye amadivaysi. Ngokungafani ne-LGA ne-PGA, ukupakishwa kwe-BGA akukhipheki futhi kungokwe-CPU esebhodini. I-CPU idayiswa ngokuqondile ebhodini lomama futhi ixhunywe ngogesi ebhodini lomama ngamajoyinti ayindilinga e-solder.

2. Ubukhulu kanye nezinzuzo zokusebenza

Inzuzo enkulu yokupakishwa kwe-BGA ukuthi incane futhi imfushane, enamandla kakhulu kumadivayisi eselula anendawo elinganiselwe, okwenza imikhiqizo ye-laptop ibe lula futhi iphatheke kalula. Ngesikhathi esifanayo, ngenxa yokuthi ukupakishwa kwe-BGA kuthengisa ngokuqinile i-CPU kanye nebhodi lomama ndawonye, ​​kunciphisa igebe phakathi kwezingxenye zokuxhuma kanye nokulahlekelwa kokudluliswa kwesignali, okungathuthukisa ukuzinza nesivinini sokudluliselwa kwesignali ngezinga elithile, ngaleyo ndlela kuthuthukise ukusebenza kwe-CPU.

4. Isiphetho

Kafushane, izindlela ezintathu zokupakisha ze-CPU ze-LGA, i-PGA ne-BGA ngayinye inezici zayo kanye nezimo ezisebenzayo. Emkhakheni wamakhompiyutha okulawula izimboni, imikhiqizo yokulawula izimboni ephezulu iyadingeka ukuze inikeze ukudlala okuphelele ekusebenzeni kwayo. I-SINSMART Technology inokuhlangenwe nakho okucebile kwemboni kanye nethimba lezobuchwepheshe. Inokuqonda okujulile kwezici kanye nezidingo zezindlela zokupakisha ze-CPU ezihlukene futhi izimisele ukuhlinzeka amakhasimende ngemikhiqizo eyenziwe ngokwezifiso, yokulawula imboni yekhwalithi ephezulu. Siyakwamukela ukubuza.