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Thov Ib Daim Ntawv Qhia Txog Tus Nqi
Lub Khoos Phis Tawj Desktop Embedded Fanless Rugged Box PC Q670e Chipset 64g 9usb
10th-13th Gen Intel Embedded PC
Cov Khoom Pawg
Cov Khoom Tshwj Xeeb

Lub Khoos Phis Tawj Desktop Embedded Fanless Rugged Box PC Q670e Chipset 64g 9usb

CPU: Intel® Core™ 12th CPU (35W/65W) LGA1700.

2 * qhov chaw nco, txhawb nqa 64G DDR5 4800 SDRAM.

Zaub: 1 * VGA chaw nres nkoj, kev daws teeb meem 1920x1200,1 * DVI-D chaw nres nkoj, kev daws teeb meem 1920x1200,1 * DP chaw nres nkoj, kev daws teeb meem 4096x2304

Hard disk: 2 * SATA ports, txuas nrog 2.5-nti hard disk, txhawb RAID 0/1 1 M.2 2280 M key NVMe slot (PCle Gen4x4), txhawb NVMe SSD.

Qhov hnyav txog li 4.4 kg.

Cov cheeb tsam siv: Tsheb, tshuab pom kev, khoom siv semiconductor thiab lwm yam xwm txheej siv

Qauv: SIN-3116-Q670E

  • Qauv SIN-3116-Q670E
  • Loj 240x225 x90 hli

1. Lub CPU ntawmlub computer uas ruaj khovNws muaj 1 I7-13700 chip, thiab lub zog siv ntawm lub chip no tuaj yeem ncav cuag 65W. Nws muaj cov roj silicone uas ua kom sov, uas yog cov taw tes-rau-taw tes sib raug rau cov khoom cua sov ntawm lub motherboard. Cov cua sov raug coj mus rau qhov cua sov dorsal fin los ntawm lawv. Kev ua haujlwm ntawm cov cua sov yog siab heev thiab ruaj khov. Ob lub 32G DDR phau ntawv nco chips thiab 128G M.2 2242 solid state drive tau teeb tsa.

2. Cov chaw nres nkoj ntawm lub vaj huam sib luag pem hauv ntej muaj 6 lub chaw nres nkoj network, uas 5 yog 2.5G network chaw nres nkoj thiab 1 yog gigabit network chaw nres nkoj. Cov 4 lub chaw nres nkoj no kuj txhawb nqa POE kev ua haujlwm. Ib qho Type-c interface, uas tsis tshua muaj nyob rau ntawm kev lag luam embedded pc, yog 1 DP ntawm no, DVI interface thiab VGA interface ntawm no. Tom qab ntawd ntawm no yog 8 USB 3.2 interfaces, uas 5 tus nqi kis tau yog 5G ib ob thiab 5 yog 10G ib ob. Interface ntawm lub vaj huam sib luag tom qab, 4 lub chaw nres nkoj serial, lub chaw nres nkoj 8-48V DC, thiab lub chaw nres nkoj tswj chaw taws teeb.

3. Kev kub ua haujlwm: 35W CPU -25 ℃-70 ℃, 65w CPU -25 ℃-70 ℃ (35w TDP) -25 ℃-50 ℃ (65w TDP).

Lub Khoos Phis Tawj Desktop Embedded Fanless Rugged Box PC
Lub Khoos Phis Tawj Desktop Embedded Fanless Rugged Box PC
Lub Khoos Phis Tawj Desktop Embedded Fanless Rugged Box PC

Cov khoom tsis

Chipset Intel® Q670E chipsets
CPU Intel® Core™ 12th CPU (35W/65W) LG1700
Nco 2 * qhov chaw nco, txhawb nqa 64G DDR5 4800 SDRAM
Zaub 1 * VGA chaw nres nkoj, kev daws teeb meem 1920x1200,1 * DVI-D chaw nres nkoj, kev daws teeb meem 1920x1200,1 * DP chaw nres nkoj, kev daws teeb meem 4096x2304
Hard disk 2 * SATA chaw nres nkoj, txuas nrog 2.5-nti hard disk, txhawb RAID 0/1 1 M.2 2280 M key NVMe qhov (PCle Gen4x4), txhawb NVMe SSD
Kev Txuas Ntxiv Lub thawv nthuav dav muab 1 * PClex16 qhov @ Gen3 (x8 teeb liab), 1 * qhov ntev mini PCIe qhov, 1 * M.2 2242/3052 B qhov tseem ceeb, thiab muab SIM daim npav qhov rau kev txhim kho M.2 5G / 4G modules) expandable I / O modules (khoob raws li tus qauv)
Chaw nres nkoj hauv internet 5 * 2.5G Ethernet chaw nres nkoj siv i255 chips, 1 * Gigabit Ethernet chaw nres nkoj siv i219 nti
NROG 2 * software programmable RS-232/422/485 COM chaw nres nkoj 2 * 3-hlau RS-232 COM chaw nres nkoj
USB 1 * USB3.2Gen 2 x2 (20Gbps) chaw nres nkoj (Hom-C), 4 * USB3.2Gen 2 x1 (10Gbps) chaw nres nkoj (Hom-A), 2 * USB3.2Gen 1x1 (5Gbps) chaw nres nkoj (Hom-A), 2 * USB2.0 chaw nres nkoj (Hom-A)
Suab 1 lub microphone input thiab lub tso suab (3.5mm jack)
kev muab hluav taws xob 1 * 3 core ntsaws rau hauv lub davhlau ya nyob twg thaiv, Muab 8-48V DC tswv yim 1 * 3core plugin davhlau ya nyob twg thaiv, Muab kev tswj chaw taws teeb thiab PWR LED tso zis
Qhov Loj ntawm lub chassis 240 (dav) x225 (qhov tob) x90 (qhov siab) mm
Kub ua haujlwm 35W CPU -25 ℃-70 ℃, 65w CPU -25 ℃-70 ℃ (35w TDP) -25 ℃-50 ℃ (65w TDP)
Qhov kub cia khoom -40 ℃ -85 ℃
qhov hnyav 4.4kg (Xws li CPU, GPU, nco thiab hard disk)
DTB-3116 (1)7ibDTB-3116 (2)6ikDTB-3116 (3)1znDTB-3116 (4)p0hDTB-3116 (5)hsjDTB-3116 (6)rnrDTB-3116 (7)nbxDTB-3116 (8)lvcDTB-3116 (9)xuqDTB-3116 (10)4z7DTB-3116 (11)3jg

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  • sinsmarttech@gmail.com
  • 3F, Block A, Future Research & Innovation Park, Yuhang District, Hangzhou, Zhejiang, China

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