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Intel Core i3/i5/i7/i9 Q670E chipset 32G fanless embedded computer industrial pc

4G/5G Industrial Computer

Intel Core i3/i5/i7/i9 Q670E chipset 32G fanless embedded computer industrial pc

▶  Q670E chipset, CPU socket for LGA1700 architecture, support 12/13 generation Core i3/i5/i7/i9
▶  With two DDR5 memory slots, support 64GDDR5 4800 SDRAM
▶  Harddisk:2*SATA ports, can connect to 2.5 hard drive, supports RAID O/1
1*M.2 2280 M key NVMe slot
▶  Operating temperature:-25℃~60℃,Storage temperature:-40~85℃
▶  Chassis size:240x225x110.5mm,weight about 3.89kg
▶  This machine is suitable for real-time artificial intelligence reasoning applications that require multiple cameras, such as production line visual inspection, security monitoring/intelligent transportation systems, intelligent video analysis or autonomous mobile robots (AMR).
▶ Model:SIN-3180-Q670E

  • Model SIN-3180-Q670E

1.The POE powered computer ports are very rich. 5*2.5G Ethernet ports,1*Gigabit Ethernet port,4*com,1*USB 3.2 Gen2x2 (20 Gbps) port (Type-C),4*USB 3.2 Gen2x1 (10 Gbps) ports (Type-A),2*USB 3.2 Gen1x1 (5 Gbps) ports (Type-A),2*USB 2.0 interfaces (Type-A),1*microphone input and speaker output.

2.In terms of interface, this x86 embedded computer motherboard is equipped with 4 USB3.2 Gen2 interfaces with a transmission rate of 10Gbps, 2 USB3.2 Gen1 interfaces with a transmission rate of 5Gbps, 2 USB2.0 interfaces, 1 DVI interface, 1 VGA interface, 1 DP interface, and 1 Type-C interface with a transmission rate of 20Gbps. Here are 5 2.5G network ports and 1 gigabit network port, four of which support POE function.

3.In order to give full play to the excellent performance of the Core 12/13 generation processors, the previous heat dissipation design has been optimized, and an aluminum alloy heat dissipation module has been added above the memory and M.2 hard drive to conduct heat quickly and greatly improve the cooling and heat dissipation effect.

Intel Core i3/i5/i7/i9 Q670E chipset 32G fanless embedded computer industrial pc
Intel Core i3/i5/i7/i9 Q670E chipset 32G fanless embedded computer industrial pc
Intel Core i3/i5/i7/i9 Q670E chipset 32G fanless embedded computer industrial pc

Product parameter

CPU
Intel®Core™12/13th Generation Core i3/i5/i7/i9CPU
(35W/65W). LGA1700
Chipset Intel® Q670E Chipset
Memory 2*memory slots, supporting 64GDDR5 4800 SDRAM
Display
1*VGA interface, resolution 1920x1200
1*DVI-D interface, resolution 1920x1200
1*DP interface, resolution 4096x2304
Hard disk
2*SATA ports, can connect to 2.5 hard drive, supports RAID O/1
1*M.2 2280 M key NVMe slot
(PCle Gen4x4), supports NVMe SSD"
Expand
The expansion box provides 1*PCIe x16 slot @Gen3 (x16 signal)
Supports NVIDIA® discrete graphics cards with TDP within 130W
1*full length mini PCIe slot
1*M.2 3042/3052 B key slot,
(SIM card slot is provided for installing M.2 5G/4G module)
Expandable I/O module (standard configuration is empty)
Network port
5*2.5G Ethernet ports use i2251T chip
1*Gigabit Ethernet port uses 1219-LM chip
Network ports 3~6 support PoE+
COM
2*software programmable RS-232/422/485COM ports
2*RS-232 COM ports

USB
1*USB 3.2 Gen2x2 (20 Gbps) port (Type-C)
4*USB 3.2 Gen2x1 (10 Gbps) ports (Type-A)
2*USB 3.2 Gen1x1 (5 Gbps) ports (Type-A)
2*USB 2.0 interfaces (Type-A)
Audio 1*microphone input and speaker output (3.5mm jack)
Power support
1*3-core plug-in terminal block, providing 8~48V DC input
1*3-pin pluggable terminal block, providing remote control and PWRLED output

Chassis size
240(width)x225(depth)x110.5(height)mm
Operating temperature
Using 35WCPU
-25℃~60℃
Using 65WCPU
-25℃~60℃(configured as 35WTDP)
-25℃~50℃(configured as 65WTDP)
Want to operate at temperatures below zero and above 50°C,
Requires wide-temperature hard drive/SSD/NVMe SSD
Storage temperature
-40-85℃
Total weight
3.89kg
DTB-3180-Q670E 01lmmDTB-3180-Q670E 02914DTB-3180-Q670E 031zdDTB-3180-Q670E 04f82DTB-3180-Q670E 05dplDTB-3180-Q670E 070g6DTB-3180-Q670E 08phjDTB-3180-Q670E 09petDTB-3180-Q670E 10f6oDTB-3180-Q670E 11uciDTB-3180-Q670E 124qq

let's talk about your projects

  • sinsmarttech@gmail.com
  • 3F, Block A, Future Research & Innovation Park, Yuhang District, Hangzhou, Zhejiang, China

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