I-Intel Core i3/i5/i7/i9 Q670E chipset engu-32G engenafeni efakwe kwikhompyutha yezimboni
1. I Ikhompyutha esebenza nge-POE Amachweba acebile kakhulu. Amachweba e-Ethernet angu-5*2.5G,1*Gigabit Ethernet port,4*com,1*USB 3.2 Gen2x2 (20 Gbps) port (Type-C),4*USB 3.2 Gen2x1 (10 Gbps) port (Type-A),2*USB 3.2 Gen1x1 (5 Gbps) port (Type-A),2*USB 2.0 interfaces (Type-A),1*okufaka imakrofoni kanye nokukhipha isikhulumi.
2. Ngokuphathelene ne-interface, lokhu ikhompyutha efakiwe ye-x86 Ibhodi lomama lihlonyiswe ngezixhumi ezine ze-USB3.2 Gen2 ezinesilinganiso sokudlulisa esingu-10Gbps, izixhumi ezimbili ze-USB3.2 Gen1 ezinesilinganiso sokudlulisa esingu-5Gbps, izixhumi ezimbili ze-USB2.0, isixhumi esisodwa se-DVI, isixhumi esisodwa se-VGA, isixhumi esisodwa se-DP, kanye nesixhumi esisodwa se-Type-C esinesilinganiso sokudlulisa esingu-20Gbps. Nazi izixhumi zenethiwekhi ze-2.5G ezi-5 kanye nesixhumi senethiwekhi se-gigabit esingu-1, ezine zazo zisekela umsebenzi we-POE.
3. Ukuze kusebenze ngokugcwele ukusebenza okuhle kakhulu kwamaprosesa esizukulwane se-Core 12/13, umklamo wangaphambilini wokushabalalisa ukushisa ulungiselelwe, futhi imodyuli yokushabalalisa ukushisa ye-aluminium alloy ingeziwe ngaphezu kwememori kanye ne-M.2 hard drive ukuze kuqhutshwe ukushisa ngokushesha futhi kuthuthukiswe kakhulu umphumela wokupholisa nokushisa.



Ipharamitha yomkhiqizo
| I-CPU | I-Intel®Core™ 12/13th Generation Core i3/i5/i7/i9CPU (35W/65W). I-LGA1700 |
| I-Chipset | I-Chipset ye-Intel® Q670E |
| Inkumbulo | Izikhala zememori ezi-2*, ezisekela i-64GDDR5 4800 SDRAM |
| Isibonisi | Isixhumi esibonakalayo se-VGA esingu-1*, isixazululo esingu-1920x1200 Isixhumi esibonakalayo se-DVI-D esingu-1*, isixazululo esingu-1920x1200 Isixhumi esibonakalayo se-1 * DP, isixazululo esingu-4096x2304 |
| Idiski eqinile | Amachweba e-SATA angu-2*, angaxhuma ku-hard drive engu-2.5, asekela i-RAID O/1 Isikhala se-NVMe esingu-1*M.2 2280 M esikhiye (PCle Gen4x4), isekela i-NVMe SSD" |
| Nweba | Ibhokisi lokunweba linikeza isikhala esingu-1 * PCIe x16 @Gen3 (isignali x16) Isekela amakhadi ehluzo e-NVIDIA® ane-TDP ngaphakathi kwe-130W Isikhala se-PCIe esincane esingu-1* ubude obugcwele Isikhala sesikhiye esingu-1*M.2 3042/3052 B, (Isikhala sekhadi le-SIM sinikeziwe ukuze kufakwe imodyuli ye-M.2 5G/4G) Imojula ye-I/O enwebekayo (ukucushwa okujwayelekile akunalutho) |
| Imbobo yenethiwekhi | Amachweba e-Ethernet angu-5*2.5G asebenzisa i-chip ye-i2251T Imbobo ye-Ethernet ye-Gigabit engu-1* isebenzisa i-chip engu-1219-LM Amachweba enethiwekhi angu-3 ~ 6 asekela i-PoE+ |
| NE | Amachweba e-RS-232/422/485COM angahlelwa yisoftware emibili * Amachweba e-2*RS-232 COM
|
| I-USB | Imbobo engu-1*USB 3.2 Gen2x2 (20 Gbps) (Uhlobo-C) Amachweba angu-4* e-USB 3.2 Gen2x1 (10 Gbps) (Uhlobo A) Amachweba amabili e-USB 3.2 Gen1x1 (5 Gbps) (Uhlobo A) Izixhumi ze-USB 2.0 ezimbili (Uhlobo A) |
| Umsindo | Ukufakwa kwemakrofoni oku-1* kanye nokukhishwa kwesipikha (i-jack engu-3.5mm) |
| Usekelo lwamandla | Ibhulokhi yesiphelo se-plug-in engu-1*3-core, enikeza okokufaka okungu-8~48V DC Ibhulokhi yesiphelo exhunywayo engu-1*3-pin, enikeza ukulawula okukude kanye nokukhipha kwe-PWRLED
|
| Usayizi we-chassis | 240(ububanzi)x225(ukujula)x110.5(ukuphakama)mm |
| Izinga lokushisa lokusebenza | Ukusebenzisa i-35WCPU -25℃~60℃ Ukusebenzisa i-65WCPU -25℃~60℃ (kulungiselelwe njenge-35WTDP) -25℃~50℃ (kulungiselelwe njenge-65WTDP) Ufuna ukusebenza emazingeni okushisa angaphansi kwezinga-zero nangaphezulu kwama-50°C, Idinga i-hard drive/SSD/NVMe SSD enokushisa okubanzi |
| Izinga lokushisa lesitoreji | -40-85℃ |
| Isisindo esiphelele | 3.89kg |








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